Intel Technology development Very fast
Gelsinger.jpgSAN FRANCISCO - The executive of Intel, Pat Gelsinger, to provide various news about the work of the industry and Intel processor-processor companies, information about technology and design "tick-tock" is growing rapidly, including details of the latest Intel 45nm products ( nanometer) latest. He also discussed the latest developments in the computing industry in the screen saver, virtualization, and also initiated the system architecture that includes a USB interconnect that has been known until the product for the best desktop PC-based Intel ® vPro ™ in the company that will soon be present in the market.
"This supports the development of Intel and deliver in providing products that can be predicted, efficient and effective through the Roadmap kmputasi as our efforts to always refer to the Moore's Law," said Patrick Gelsinger, Senior Vice Presiedent and General Manager of Intel Digital Enterprise Group, the Intel Developer Forum event held in San Francisco, Friday (21/9/2007). "In addition to our processor-processor, Intel provides a focus on power efficiency through better design of the transistor with High-k hafnium-based, and also extra-extra on the overall architecture of the system, minimize the use of power on the computer," he added .
In his speech, Gelsinger showed server Intel 45nm High-k metal gate with a dual processor architecture is the next generation (Nehalem), which uses elements hafnium and not in the portion of Silicon where there are more than 700 million transistor in a processor, which has more or less the size of postage stamp. Nehalem is the password of the processor microarchitecture that will be present in 2008 and will provide the memory band width three times higher than the current processor. It also shows the broad support of industry for the Intel ® QuickPath Architecture. QuickPath Interconnect provides high-speed data lines for the core-core Nehalem processors.
In addition to increased performance Dan Piţa wide memory, Intel continues to be a leader in I / O when Gelsinger announced the formation 3.0 USB Promoter Group. This revolutionary architecture will use a single connector and cable that provides the performance of 10 times higher than USB 2.0 when running against kompatibelitas reversed more than 2 billion USB devices are available.
Together with Intel, Promoter Group which have already joined HP, NEC Corporation, NXP Semiconductors, Microsoft, and Texas Instruments Incorporated. USB 3.0 interface will be the I / O that includes support for copper interconnect and optically, the protocol can be measured, and optimization for power efficiency in the use of a PC, home electronic products and mobile segments ..
Gelsinger also discussed that the increase in solid state disk technology is able to be used in the enterprise server and storage technology platform to platform-IA. Gelsinger announced that products that provide substantial improvement in reading performance and power technology from Intel utilizing non-volatile memory will be available next year.
Gelsinger shared version of the consolidation of I / O on Ethernet and steps to achieve convergence network that supports both Fiber Channel over Ethernet (FCoE) and local area network. To support this version, he announced that Intel ® 82598 10 Gigabit Ethernet Controller is available now and get the support of the package solution that FCoE will be present in the year 2008.
Gelsinger also discussed Intel QuickAssist Technology and growth in the industrial product development. QuickAssist Technology, first announced at the IDF event in April, and is a collection of hardware and software technology that the needs on the akselerator platform-platform enterprise. He conducted the first review of the device, including the Intel Intel ® QuickAssist Integrated Accelerator for cryptography, which has the password Tolapai.
The target will be available in 2008, Tolapai - chip in the system - will provide a significant improvement in performance and power efficiency with the form factor throughput 8 times better, 20% more power sparingly, and footprint 45% smaller than the solution multi-component security on the embedded market segment, and communications.
Marketing technology in the development of the processor Intel ® vPro ™, Gelsinger revealed plans to combine the benefits and security settings via a PC product that has the password McCreary, which will be launched in 2008. McCreary will include dual processors and the latest quad core 45nm halogen-free, that is lead-free chipsets that have the password Eaglelake, trusted platform module that is integrated, the data enskripsi solution that has the password Danbury.
Danbury Technology build encryption and decryption of data directly into the hardware, providing better protection for the key-encryption and key management system and allows the use of key recovery easier. Intel Active Management technology also allows the operation to appear in the "out-of-band", ie, when the operating system are down or off. Bob Heard, inventor and Chief Executive Officer CREDIANT Technologies, discuss how their software security solutions can be improved in the future by combining Danbury and vPro technology. Mark B. Templeton, Chief Executive Officer Citric System, shows how the security management and centralization of data can diseimbangkan with the mobility needs of users will be using a PC and pengelaman responsive.
John Fowler, Executive Vice President Sun Microsystems, and Mendel Rosenbum, Chief Scientist and Co-Founder VMWare, and present with Gelsinger showed waves (wave) virtualization is run by Intel and other technology leaders in the industry. Both speakers demonstrate how they take advantage of innovations such as Intel Virtualization Technology and Intel Trusted Execution Technology to provide protection for the environment in a virtual environment, workstation and desktop PC in the future.
Gelsinger on the wall shows the computer system which will be launched by Intel for the needs of users in the computing and cost needs. He showed how customers can use Xeon ®-based workstation with a front-side bus that can solve scientific problems. For example, the Intel platform with the best performance of the latest generation of applications to provide best performance for computer-intensive workload, such as gas and oil exploration.
Alistair Downie, Manager Western Hemisphere R & D for Paradigm, the latest application benchmark called "Paradigm Benchmark 1" which indicates that the system 45nm Quad-core performance to give two times better than the performance offered by the processor with the same speed.
Gelsinger also discussed Ice Cube * Modular Data Center Rackable move, the server-based Intel's Xeon 1400 in a single 40-foot container truck. (sar)
Speed USB 3.0 with Multi-Gigabit
San Francisco - USB now appears with a higher technology. USB 3.0 has a speed that is higher than the previous version, 2.0.
USB 3.0 will complete in mid 2008 with a supporting device that will spread in the year 2009 so that it can be marketed to the outside in 2010. The main purpose of the SuperSpeed USB is to provide an average transfer 10 times faster than conventional cable. Currently, the transfer speed USB 2.0 is as much 480 Mbps, while USB 3.0 has a speed of 4.8 Gbps. Of course, this new cable will also minimize power consumption so that more environmental friendly.
According to PC World, Wednesday (19/9/2007), examples of targets to be achieved by USB 3.0 is the ability to transfer data in the form of High-def capacity to 27GB in a portable device, just in time 70 seconds. Speed is not equivalent to that experienced by technology highspeed USB 2.0 transfer with the total to 15 minutes.
The plan published by The "SuperSpeed" USB Promotions Group at Intel Developer Forum event. (sar)
Intel Chip Only 32 Nm
San Francisco - In place Intel Developer Forum in San Francisco, Intel will plan to improve performance and energy efficiency in microprosesornya with only 32 nanometer size only.
Yahoo News Dilansir through PC World, Wednesday (19/9/2007), this plan will be implemented in 2009. Chip's future will have more than 1.9 billion so that it is able to improve transistor performance entertainment applications and the ability graph real-life.
Chip will be on the upgrade with the size of Intel processors with 45nm Penryn processors later in November. Even at the end of next year will also be out Nehalem processors and Silverthorne. Previous Intel processors have been using and measuring 65nm Penryn is the code name of the Intel chip is the smallest at this time, only the size of 45nm.
"Chip is able to give the performance per-watt and better system performance through the design of the system QuickPath Interconnect, which is included in memory controller and integrated network communication between system components. Penryn dual-core processor will operate at 25 watts of energy and will be integrated Montevina platform in the future, including technology that Wimax them, "said Intel President and CEO, Paul Otellini. In fact, more Otellini, at the end of this year it will introduce 15 new 45nm processor types and 20 types again later in the year 2008.
Intel is not the first vendor to introduce the smallest measuring 32nm processors. In May, IBM has issued a first 32nm processor berteknologi, in collaboration with Freescale Semiconductor, Chartered Semiconductor Manufacturing, Infineon and Samsung Electronic Technology.